Introduction to MM70-314-310B1-2-R300

Ⅰ.Product overview

The MM70-314-310B1-2-R300 is an edgeboard card edge connector developed by JAE Electronics, belonging to the MM70 series. It features MXM 3.0 card type, high pin count and reliable connectivity, designed for high-density signal transmission, and is currently discontinued at DigiKey.

 

Ⅱ.Core parameter

Category:Connectors, Interconnects,Card Edge Connectors,Edgeboard Connectors

Manufacturer:JAE Electronics

Series:MM70

Packaging:Tape & Reel

Part Status:Discontinued at DigiKey

Card Type:MXM 3.0

Number of Positions:314

Card Thickness:0.047" (1.20mm)

Pitch:0.020" (0.50mm)

Read Out:Dual

Mounting Type:Surface Mount, Right Angle

Termination:Solder

Contact Material:Copper Alloy

Contact Finish Thickness:11.8µin (0.30µm)

Operating Temperature:-40°C ~ 85°C

Material - Insulation:Liquid Crystal Polymer (LCP), Glass Filled

 

Ⅲ.Main characteristics

MXM 3.0 Standard:Complies with MXM 3.0 card type specification, specifically designed for high-speed signal transmission scenarios such as GPU modules, ensuring compatibility with MXM-based devices.

High Pin Count:Equipped with 314 positions, enabling simultaneous transmission of multiple signals and power, meeting the demand for high-density interconnect in complex electronic devices.

Fine Pitch Design:Features a 0.020" (0.50mm) fine pitch, effectively saving PCB space and facilitating compact layout of high-density electronic components.

Dual Read Out:Adopts dual read out design, enhancing signal transmission stability and anti-interference ability, ensuring accurate and reliable data transmission.

Durable Construction:Uses copper alloy contact material with 11.8µin (0.30µm) contact finish thickness, ensuring good electrical conductivity and wear resistance for long-term use.

Reliable Insulation:Insulation material is glass-filled Liquid Crystal Polymer (LCP), which has excellent heat resistance, mechanical strength and electrical insulation performance.

 

Ⅳ.Application field

MXM GPU Modules:Used to connect MXM 3.0 GPU modules to motherboards in all-in-one computers, enabling high-speed signal transmission between the GPU and other component.

Notebook GPUs:Used in notebook computers with replaceable GPU modules, connecting MXM 3.0 graphics cards to the notebook motherboard for easy GPU upgrade.

Embedded Systems:Connects high-pin-count functional modules to the main control board in embedded devices, saving layout space.

Test Equipment:Used in benchtop test instruments to connect signal acquisition cards and main control units, ensuring accurate transmission of test data with its stable connectivity.

Medical Monitors:Connects high-resolution display panels and signal processing boards in portable medical monitors, ensuring stable transmission of medical data.

 

Ⅴ.Summary

The MM70-314-310B1-2-R300 is a high-performance edgeboard connector of JAE Electronics’ MM70 series,featuring MXM 3.0 compatibility,high pin count and reliable performance.Despite being discontinued at DigiKey,its excellent electrical and mechanical properties make it suitable for GPU modules,industrial equipment and notebook computers,providing stable high-density interconnect solutions.